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omnidirectional microphone with bottom port and digital output data sheet admp421 rev. d information furnished by analog devices is believed to be accurate and reliable. however, no responsibility is assumed by analog devices for its use, nor for any inf ringements of patents or other rights of third parties that may result from its use. specifications subject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and regi stered trademarks are the property of their respective owners. one technology way, p.o. box 9106, norwood, ma 02062 - 9106, u.s.a. tel: 781.329.4700 www.analog.com fax: 781.461.3113 ? 2010 C 20 11 analog devices, inc. all rights reserved. features small and thin 3 mm 4 mm 1 mm surface - mount package high snr of 61 dba high sensitivity of ? 26 dbfs flat frequency response from 100 hz to 1 5 khz low current consumption : < 650 a sleep mode for extended battery life high psr of 80 dbfs fourth - order - modulator digital pdm output compatible with sn/pb and pb - free solder processes rohs/weee compliant applications smartphones and feature phones teleconferencing systems digital video cameras bluetooth h eadsets video phones tablets general des cription the admp421 is a high performance , low power , digital output bottom - ported omnidirectional mems microphone. the admp421 consists of a mems microphone element a n d an impedance converter amplifier followed by a fourth - order - modulator. the digita l interface allows for the pulse density modulated ( pdm ) output of two microphones to be time - multiplexed on a single data line using a single clock . the admp421 has a high snr and high sensitivity , making it an excellent choice for far field applications. the admp421 has a flat wideband frequency response , resulting in natural sound with high intelligibility. low current consumption and a sleep mode enable long battery life for portable applications. a built - in particle filter provides high reliability. th e admp421 complies with the tia - 920 telecommunications telephone terminal equipment transmission requirements for wideband digital wireline telephones standard . the admp421 is available in a thin 3 mm 4 mm 1 mm surface - mount package. it is reflow solde r compatible with no sensitivity degradation. the admp421 is halide free. functional block dia gram admp421 ad c power management clk data vdd gnd pdm modulator channel select l/r select 07596-001 figure 1.
important links for the admp421 * last content update 09/20/2013 09:57 pm documentation an-1140: microphone array beamforming an-1124: recommendations for sealing analog devices, inc., bottom- port mems microphones from dust and liquid ingress an-1112: microphone specifications explained an-1068: reflow soldering of the mems microphone an-1003: recommendations for mounting and connecting analog devices, inc., bottom-ported mems microphones cn-0078: imems digital microphone simplifies the interface to a sigmadsp audio codec introducing imems (r) microphones this video compares the admp401 analog mems and the admp421 digital mems. ug-326: pdm digital output mems microphone evaluation board ug-183: evaluation board user guide for admp421 ug-118: eval-admp421z bottom port digital output mems microphone evaluation board user guide ms-2472: analog and digital mems microphone design considerations ms-2275: common inter-ic digital interfaces for audio data transfer a history of consumer microphones: industrial ics evaluation kits & symbols & footprints mems microphone evaluation boards admp421 flex evaluation board admp421z evaluation board symbols and footprints product recommendations & reference designs cn-0078: digital mems microphone simple interface to a sigmadsp audio codec design support submit your support request here: linear and data converters embedded processing and dsp telephone our customer interaction centers toll free: americas: 1-800-262-5643 europe: 00800-266-822-82 china: 4006-100-006 india: 1800-419-0108 russia: 8-800-555-45-90 quality and reliability lead(pb)-free data parametric selection tables find similar products by operating parameters consider admp401: omnidirectional microphone with bottom port and analog output consider admp404: omnidirectional microphone with bottom port and analog output consider admp405: omnidirectional microphone with bottom port and analog output consider admp441: omnidirectional microphone with bottom port and analog output consider admp504: omnidirectional microphone with bottom port and analog output consider admp521: omnidirectional microphone with bottom port and analog output design tools, models, drivers & software microphone beamforming simulation tool (32-bit) - documentation for the microphone beamforming simulator microphone beamforming simulation tool (64-bit) - documentation for the microphone beamforming simulator admp421 ibis model suggested companion products recommended audio codecs for the admp421 for a low power sigmadsp codec with headphone driver and pll, we recommend the adau1761 . for a low power sigmadsp codec with mono speaker driver and pll, we recommend the adau1781 . for a low power, 24-bit audio codec with headphone driver and pll, we recommend the adau1361 . for a low power, 24-bit audio codec with a fixed-function tunable signal processor, we recommend the adau1381 . for a low power, multi-channel, 24-bit audio codec in a wafer level chip scale package, we recommend the adau1373 . sample & buy admp421 view price & packaging request evaluation board request samples check inventory & purchase find local distributors * this page was dynamically generated by analog devices, inc. and inserted into this data sheet. note: dynamic changes to the content on this page (labeled 'important links') does not constitute a change to the revision number of the product data sheet. this content may be frequently modified. powered by tcpdf (www.tcpdf.org)
admp421 data sheet rev. d | page 2 of 16 table of contents features .............................................................................................. 1 applications ....................................................................................... 1 general description ......................................................................... 1 functional block diagram .............................................................. 1 revision history ............................................................................... 2 specifications ..................................................................................... 3 timing characteristics ................................................................ 4 absolute maximum ratings ............................................................ 5 esd caution .................................................................................. 5 pin configuration and function descriptions ............................. 6 typical performance characteristics ............................................. 7 pcb land pattern layout ................................................................ 8 alternat e pcb land patterns ...................................................... 9 applications information .............................................................. 10 interfacing with analog devices codecs ................................ 10 sleep mode .................................................................................. 10 power savings when disabling one microphone in a multimicrophone application .................................................. 10 suppor ting documents ............................................................. 10 handling instructions .................................................................... 11 pick - and - place equipment ....................................................... 11 reflow solder .............................................................................. 11 board wash ................................................................................. 11 reliability specifications ................................................................ 12 outline dimensions ....................................................................... 13 ordering guide .......................................................................... 13 revision hi story 1 1 /11 rev. c to rev. d changed psrr to psr ....................................................... universal changed pb - free temperature from 245c to 2 60c, table 4 .. 5 changes to figure 8 and figure 9 ................................................... 8 added alternate pcb la n d patterns section ............................... 9 changes to temperature humidity bias ( thb ) description, table 6 .............................................................................................. 12 8/11 rev. b to rev. c changes to clock frequency and supply voltage parameters, table 1 ................................................................................................ 3 ch anges to table 3 and table 4 ....................................................... 5 deleted power - saving features section ........................................ 8 changes to figure 9 .......................................................................... 8 added applications information section ..................................... 9 added supporting documents, evaluation board user guides, circuit note, and application notes sections .............................. 9 changes to interf acing with analog devices codecs section ................................................................................................ 9 moved sleep mode section and power savings when disabling one microphone in a multimicrophone application section ... 9 changes to figure 10 ........................................................................ 9 change to pick - and - place equipment section ........................... 10 deleted evaluation board se ction ................................................ 10 deleted figure 10 and figure 11; renumbered sequentially ... 10 deleted table 6; renumbered sequentially ................................. 10 deleted figure 12 ............................................................................ 11 change to temperature cycle description, table 6 .................. 11 changes to ordering guide .......................................................... 12 6 /11 rev. a to rev. b changes to figure 1 ........................................................................... 1 changes to figure 5 ........................................................................... 7 2 /11 rev. 0 to rev. a changes to features section, applications section, and general description section ............................................................ 1 added dynamic range parameter, changes to input characteristics parameter and output characteristics parameter, delete d polarity parameter, table 1 ............................ 3 changes to table 3 ............................................................................. 5 changes to table 5 ............................................................................. 6 added power - saving features section ........................................... 8 updated outline dimensions ....................................................... 13 changes to ordering guide .......................................................... 13 4 / 10 revision 0 : initial version
data sheet admp421 rev. d | page 3 of 16 specifications t a = 25c, v dd = 1.8 v , clk = 2.4 mhz, unless otherwise noted. all minimum and maximum specifications are guaranteed. typical specifications are not guaranteed. table 1 . parameter symbol test conditions /comments min typ max unit performance directionality omni sensitivity 1 1 khz, 94 db spl ? 29 ? 26 ? 23 dbfs signal -to - noise ratio snr 20 khz bandwidth, a - weighted 6 1 dba equivalent input noise ein 20 khz bandwidth, a - weighted 33 dba spl dynamic range derived from ein and maximum acoustic input 8 7 db frequency response 2 low frequency ? 3 db point 100 hz high frequency ? 3 db point 15 k hz deviation limits from flat response within pass band ?3/+2 db total harmonic distortion thd 105 db spl 3 % power supply rejection psr 217 hz , 100 mv p - p square wave superimposed on v dd = 1.8 v 80 dbfs maximum acoustic input peak 120 db spl input characteristics clock frequency clk 1.0 2.4 3 3.3 mhz clock duty ratio clock frequency of 2.4 mhz or less 40 60 % input voltage hig h v ih 0.65 v dd v input voltage low v il 0.35 v dd v output characteristics output voltage high v oh i load = 0.5 ma 0. 7 v dd v dd v output voltage low v ol i load = 0.5 ma 0 0.3 v dd v latency <30 s wake - up time from sleep mode, po wer on 10 m s power supply supply voltage v dd 1.8 3.3 v supply current i s normal mode 650 a sleep mode 4 50 a 1 relative to the rms level of a sine wave with positiv e amplitude equal to 100% 1s density and negative amplitude equal to 0% 1s density. 2 see figure 5 and figure 6 . 3 the microphone operate s at any clock frequency between 1.0 mhz and 3.3 mhz. some specific ations may not be guaranteed at frequencies other than 2.4 mhz. 4 the microphone enters sleep mode when the clock is turned off or the clock frequency is less than 1 khz.
admp421 data sheet rev. d | page 4 of 16 timing characteristics table 2. parameter description min max unit input t clkin input clock period 310 1000 ns output t 1outen data1 driven after falling clock edge 30 ns t 1outdis data1 disabled after rising clock edge 20 ns t 2outen data2 driven after rising clock edge 30 ns t 2outdis data2 disabled after falling clock edge 20 ns timing diagram t clkin clk data2 data1 07596-002 t 2outdis t 1outdis t 2outen t 1outen figure 2. pulse density modulated output timing
data sheet admp421 rev. d | page 5 of 16 absolute maximum ratings table 3. parameter rating supply voltage ?0.3 v to 3.6 v digital pin input voltage ?0.3 v to v dd + 0.3 v or 3.6 v, whichever is less sound pressure level (spl) 160 db mechanical shock 10,000 g vibration per mil-std-883 method 2007, test condition b temperature range ?40c to +85c stresses above those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. esd caution 07596-003 t p t l t 25c to peak t s preheat critical zone t l to t p temper a ture time ramp-down ramp-up t smin t smax t p t l figure 3. recommended soldering profile limits table 4. recommended soldering profile limits profile feature sn63/pb37 pb free average ramp rate (t l to t p ) 1.25c/sec max 1.25c/sec max preheat minimum temperature (t smin ) 100c 100c maximum temperature (t smax ) 150c 200c time (t smin to t smax ), t s 60 sec to 75 sec 60 sec to 75 sec ramp-up rate (t smax to t l ) 1.25c/sec 1.25c/sec time maintained above liquidous (t l ) 45 sec to 75 sec ~50 sec liquidous temperature (t l ) 183c 217c peak temperature (t p ) 215c +3c/?3c 260c +0c/?5c time within 5c of actual peak temperature (t p ) 20 sec to 30 sec 20 sec to 30 sec ramp-down rate 3c/sec max 3c/sec max time 25c (t25c) to peak temp erature 5 minute max 5 minute max
admp421 data sheet rev. d | page 6 of 16 pin configuration an d function descripti ons 1 2 3 clk l/r select gnd data v dd 4 5 07596-007 figure 4. pin configuration (bottom view) table 5 . pin function descriptions pin no. mnemonic description 1 clk clock input to microphone . 2 l/r select left channel or right channel select . data1 ( r ight ) : l/r select tied to gnd. data2 ( l eft ) : l/r select pulled to v dd . 3 gnd ground . 4 v dd power supply . placing a 0.1 f (100 nf) ceramic type x7r capacitor between pin 4 (v dd ) and ground is strongly recommended f or best performance and to avoi d potential parasitic artifacts. the capacitor should be placed as close to pin 4 as possible. 5 data digital output signal (data1, data2) .
data sheet admp421 rev. d | page 7 of 16 typical performance characteristics ?10 ?8 ?6 ?4 ?2 0 2 4 6 8 10 100 10k 1k frequency (hz) (db) 07596-004 figure 5 . frequency response mask 10 0 ?10 ?20 100 1k 10k frequency (hz) (db) 07596-005 figure 6 . typical frequency response (measured) ?100 ?90 ?80 ?70 ?60 ?50 ?40 200 500 1k 2k 5k 10k 20k 07596-006 frequency (hz) psr (dbfs) figure 7 . typical power supply rejection vs. frequency
admp421 data sheet rev. d | page 8 of 16 pcb land pattern layout the recommended pcb land pattern for the admp421 should be laid out to a 1:1 ratio to the solder pads on the microphone package, as shown in figure 8. care should be taken to avoid applying solder paste to the sound hole in the pcb. a suggested solder paste stencil pattern layout is shown in figure 9. the diameter of the sound hole in the pcb should be larger than the diameter of the sound port of the microphone. a minimum diameter of 0.5 mm is recommended. 4 0.40 0.60 (0.30) 0.90 (0.30) ?1.70 3.80 (0.30) (1.000) (0.550) 0.35 2.80 2 r0.10 (0.30) 0.35 2.05 0.70 ?1.10 07596-008 center line figure 8. suggested pcb land pattern layout 1.45 0.9 2.45 0.7 1.525 1.000 0.35 1.849 1.849 1.498 0.205 wide 0.248 0.498 (2) 0.248 1.148 (2) 0.248 0.948 (2) 1.498 0.248 0.398 0.298 (4) 0.362 cut (3) 1.17 24 24 07596-009 0.375 c ente r line figure 9. suggested solder paste stencil pattern layout
data sheet admp421 rev. d | page 9 of 16 alternate pcb land p atterns the admp 4 21s standard pcb land pattern has a solid ring around the edge of the footprint, which may make routing the microphone signals more diff icult in some board designs. this ring is used to improve the rf immunity performance of the admp 4 21, but it is not necessary to have this full ring connected for electrical functionality. if a design can tolerate reduced rf immunity then this ring can eit her be broken or removed completely from the pcb footprint. figure 10 shows an example land pattern with no enclosing ring around the edge of the part, and figure 11 shows an example pattern with the ring broken on two sides so that the inner pads can be more easily routed on the pcb. 07596-0 1 1 figure 10 . example pcb land pattern with no enclosing ring 07596-012 figure 11 . example pcb land pattern with broken enclosing rin g note that in both of these patterns, the solid ring around the sound port is still present; this ring is needed to ground the microphone and for acoustic performance. the pad on the package connected to this ring is ground and still needs a solid electri cal connection to the pcb ground. if a pattern like one of these two examples is used on a pcb, take care that the unconnected ring on the bottom of the admp 4 21 is not placed directly over any exposed copper. this ring on the microphone is still at ground and any pcb traces routed underneath it need to be properly masked to avoid short circuits.
admp421 data sheet rev. d | page 10 of 16 applications informa tion interfacing with ana log devices codecs analog devices adau1361 , adau176 1 , and adau1781 codecs feature digital microphone inputs that support the admp421 pdm output data format. see the connection diagrams shown in figure 12, and refer to the an - 1003 application note and the codecs respective data sheets for more details on the digital microphone interface. sleep mode the microphone enters sleep mode when the clock is turned off or the clock frequency falls below 1 khz. in sleep mode, the microphone data output is in high impedance state and t he current consumption is less than 50 a. power savings when d isabling one microphone in a mult imicrophone application the admp421 has a uniqu e power - saving feature when used in systems where two or more microphones share the same clock and/or data lines. the microphone is designed to present high impedance on both the clock and data pins when the power supply (v dd ) pin is at 0 v or floating. th is disabled microphone presents no load to and consumes no power from other active microphones. supporting documents evaluation board user guides ug - 118, e val - admp421z bottom port digital output mems microphone evaluation board ug - 183, e val - admp421z - flex: bottom - ported digital output mems microphone evaluation board circuit note cn - 0078, imems digital microphone simplifies the interface to a sigmadsp audio codec application notes an - 1003, recommendations for mounting and connecting analog devices, inc., bottom - ported mems microphones an - 1068, reflow soldering of the mems microphone an - 1112, microphone specifications explained an - 1124, recommendations for sealing analog devices, inc., bottom - port mems microphones from dust and liquid ingress admp421 clk v dd l/r select gnd data 0.1f admp421 clk v dd l/r select gnd data 0.1f micbias avdd 1.8v to 3.3v jackdet/micin bclk/gpio2 adau1361 or adau1761 07596-010 dgnd agnd figure 12 . adau1361 and adau1761 stereo interface block diagram
data sheet admp421 rev. d | page 11 of 16 handling instruction s pic k - and - place equipment the mems microphone can be handled using standard pick - and - place and chip shooting equipment. care should be taken to avoid damage to the mems microphone structure as follows: ? use a standard pickup tool to handle the microphone. becau se the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface. ? use care during pick - and - place to ensure t hat no high shock events above 1 0 k g are experienced because such events may cause damage to the microphone. ? do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. do not pull air out of or blow air into the microphone port. ? do not use excessive force to place the microphone on the pcb . re flow solder for best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used to attach the mems microphone to the pcb . it is recommended that the solder reflow profile not exceed the limi t conditions specified in figure 3 and table 4 . board wash when washing the pcb, ensure that water does not make contact with the microphone port. blow - off procedures and ultrasonic cleaning must not be u sed.
admp421 data sheet rev. d | page 12 of 16 reliability specific ations the microphone sensitivity after stress must deviate by no more than 3 db from the initial value. table 6 . stress test description low temperature operating life ?40c, 500 h ou rs, powered high temperature operating life +125c, 500 h ou rs , powered temperature humidity bias ( thb ) +85c/ 85% relative humidity (rh), 500 h ou rs , powered temperature cycle ?40 c /+125c, one cycle per hour, 1 000 cycles high temperature s torage + 150c, 500 h ou rs low temperature storage ? 40c, 500 h ou rs component cdm esd all pins, 0 .5 kv component hbm esd all pins, 1.5 kv component mm esd all pins, 0 .2 kv
data sheet admp421 rev. d | page 13 of 16 outline dimensions 06-16-2010-g 1.50 2.80 bottom view top view side view r e f e r e n c e c o r n e r 4.10 4.00 3.90 3.10 3.00 2.90 12 3 4 5 0.90 2.48 ref 0.72 ref 3.54 ref 1.05 ref 2.05 3.80 0.70 0.30 ref 0.25 dia. (thru hole) 1.10 dia. r0.10(2 ) 1.70 dia. 0.95 ref 0.35 0.35 0.30 ref 0.30 ref 1.10 1.00 0.90 0.24 ref 0 . 4 0 0 . 6 0 ( p i n s 1 , 2 , 4 , 5 ) 0.30 ref p i n 1 figure 13. 5-terminal chip array small outline no lead cavity [lga_cav] 4 mm 3 mm body (ce-5-1) dimensions shown in millimeters 12.30 12.00 11.70 062408-a notes: 1. 10 sprocket hole pitch cumulative tolerance 0.20. 2. pocket position relative to sprocket hole measured as true position of pocket, not pocket hole. 4.80 3.20 1.50 min dia 8.00 4.00 1 1.60 max 1.50 nom a a section a-a 2.05 2 2.00 1.95 0.20 max 1.30 ref 1.60 0.35 0.30 0.25 3.80 2.20 1.85 1.75 1.65 5.55 2 5.50 5.45 detail a 0.50 r 0.25 0.25 detail a figure 14. lga_cav tape an d reel outline dimensions dimensions shown in millimeters ordering guide model 1 temperature range package description package option 2 ordering quantity ADMP421BCEZ-RL ?40c to +85c 5-terminal lga_cav, 13 tape and reel ce-5-1 5,000 ADMP421BCEZ-RL7 ?40c to +85c 5-terminal lga_cav, 7 tape and reel ce-5-1 1,000 eval-admp421z evaluation board eval-admp421z-flex flex evaluation board 1 z = rohs compliant part. 2 this package option is halide free.
admp421 data sheet rev. d | page 14 of 16 notes
data sheet admp421 rev. d | page 15 of 16 notes
admp421 data sheet rev. d | page 16 of 16 notes ? 2010 C 2011 analog devices, inc. all rights reserved. trademarks and registered trademarks are the property of their respective owners. d07596 - 0- 11/11(d)

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